Austin Semiconductor, Inc. Announces 512Mb SDRAM, 54-Pin TSOPII with Copper Lead Frame

Austin, Texas - October 2008 - Austin Semiconductor, Inc. (ASI), a leading technology solutions provider for the high-reliability marketplace, has expanded their semiconductor assembly services by adding the only onshore TSOPII capability to their extensive line of products and services.

The first product is a 512Mb, 54-Pin TSOPII SDRAM with copper lead frame. The TSOPII features a Lead on Chip (LOC) design, which allows the size of the package to be approximately the chip size, which reduces the size to the minimum.

The device is a 512Mb, 32Mb x 16, 3.3V, SDRAM, measuring 22.30mm x 11.76mm, with a height of 1.2mm. This product is currently available.

The TSOPII is ideally suited for High-Temperature applications in the Automotive / Industrial / Military industries, cellular base stations, gas / oil explorations, Aerospace & Avionics, Engine Control, On-Board Flight Computers, Radar / Sonar etc.

For further information please contact the MSC Vertriebs GmbH.

Contact: pl@msc-ge.com